產品系列
晶圓雷射刻號機 Wafer laser marking system
DETAIL詳細介紹
Specification
> 100 WPH, base on
1. Marking depth >50um
2. Include ID reading
1. OCR code (SEMI M12, M13, with SEMI Checksum)
2. 2D matrix (SEMI T7)
3. Bar code (BC412)
4. Flexible adjusting of characters (Char height, width, and spacing)
5. Flexible adjusting the marking angle.
6. Marking area limitation: Please provide the information.
1. Dot diameter: 100um +/- 10u 2. Depth> 50um achievable
Class 1
Vacuum chuck type
